SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › TDK releases miniaturized, high performance thin-film common-mode filters for mobile devices
  • 0

TDK releases miniaturized, high performance thin-film common-mode filters for mobile devices

SemiMediaEdit
September 1, 2021

TDK Corporation recently introduced the TCM0403M series of miniature thin film common mode filters for mobile devices. The 0403 case size (0.45 x 0.3 x 0.23mm) is 58 % smaller and 56 % lighter than previous products. With its high common-mode attenuation characteristic, these products reduce intruding noise and improve wireless signal reception sensitivity. The common mode attenuation at 2.4 GHz is 21 dB, and 28 dB at 5.0 GHz, with a maximum permissible current of 50 mA. Mass production started in August 2021.

Due to the growing multifunctionality of wireless devices such as smartphones, wearables and other mobile products, noises generated inside the devices are deteriorating wireless signals. It is critical to prevent the deterioration of signal reception sensitivity and to prevent external noise that has the potential to cause device malfunction; this series addresses those common challenges.

The products are mountable in ultra-small spaces due to their 58 % footprint reduction, which was previously impossible with the existing TCM0605 Series (0.65 x 0.5 ㎜ case size). By improving TDK’s proprietary fine pattern technology and optimizing design, the products feature a common-mode attenuation characteristic that equals existing products and a differential transmission characteristic capable of supporting high-speed signal transmission.

TDK’s wide array of products meets the needs for common filters for high-speed differential signal lines, including for USB, MIPI and HDMI.

Click TCM0403M to learn more.

Related

electronic components news TCM0403M TDK
Nexperia launches ‘Power Live’ September 21-23 2021
Previous
Renesas Completes Acquisition of Dialog Semiconductor
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
What is the root cause of the decline of the Japanese semiconductor industry?

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

ST launches Stellar P3E automotive MCU with on-chip AI acceleration for SDV platforms

ST launches Stellar P3E automotive MCU with on-chip AI acceleration for SDV platforms

February 11, 2026
0
SemiAnalysis: Micron loses NVIDIA Rubin HBM4 first-year supply over pin rate issues

SemiAnalysis: Micron loses NVIDIA Rubin HBM4 first-year supply over pin rate issues

February 11, 2026
0
Infineon sells Thailand backend site to MPI as it reshapes power chip supply chain

Infineon sells Thailand backend site to MPI as it reshapes power chip supply chain

February 11, 2026
0
VIS may lift 8-inch wafer prices from April amid AI-driven demand

VIS may lift 8-inch wafer prices from April amid AI-driven demand

February 10, 2026
0
1
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator