SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Yageo and Foxconn establish a semiconductor joint venture
  • 0

Yageo and Foxconn establish a semiconductor joint venture

SemiMediaEdit
May 7, 2021

Yageo and Foxconn yesterday jointly announced the establishment of a joint venture company, XSemi Corporation, to develop and sell semiconductors.

Pierre Chen, chairman of Yageo Group, said that Xsemi is expected to be established in the third quarter of this year and will initially focus on power and analog semiconductor products with an average unit price of less than two US dollars. At present, it has started discussions with a number of world-class semiconductor companies, and will announce cooperation projects in related semiconductor fields in the near future.

"Through the establishment of the joint venture, Yageo's product line can be further expanded from passive components to semiconductor devices, providing existing customers with a more complete component supply chain," Pierre Chen added.

Foxconn said that the semiconductor industry is currently undergoing the biggest changes in 30 years, and the industrial order will be reorganized. Now is undoubtedly the best time for multi-party strategic cooperation. Xsemi will play the most critical part of Foxconn's development roadmap.

Related

electronic components news Foxconn Xsemi Yageo
ST announces high-performance GaN family for automotive applications
Previous
SIA: Global semiconductor sales increase 3.6% over previous quarter
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

June 13, 2025
0
Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

June 13, 2025
0
Micron to build semiconductor SEZ in India under $1.6 billion investment plan

Micron to build semiconductor SEZ in India under $1.6 billion investment plan

June 12, 2025
0
Wolfspeed trims 73 jobs in North Carolina amid weak SiC chip demand

Wolfspeed trims 73 jobs in North Carolina amid weak SiC chip demand

June 12, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator