SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Intel and Micron sign new 3D XPoint supply agreement
  • 0

Intel and Micron sign new 3D XPoint supply agreement

SemiMediaEdit
March 18, 2020

According to reports, Intel and Micron have signed a new 3D XPoint memory chip supply agreement. Analysts believe that Intel will now have to pay Micron more than before because it is the only manufacturer of 3D XPoint.

After ending its partnership with Micron's NAND and 3D XPoint, Intel sold shares in its wafer fab in Lehi, Utah. Since Intel has not yet transferred the production of the Optane series products based on 3D XPoint to the Fab 68 factory in Dalian, China, it must sign a supply agreement with Micron. Under the agreement, Micron Technology will sell 3D XPoint to Intel at a pre-agreed price for one year after acquiring ownership of the fab.

The statement shows that on March 9, Micron and Intel agreed to terminate the product supply agreement between Micron, Intel and Micron Semiconductor Asia Pte. Ltd. (the "PSA") signed on April 6, 2012, and it has entered into force on March 6. At the same time the contract was terminated, Micron signed a new agreement with Intel. The two companies did not disclose further details, only that the new agreement changed pricing and rights terms.

 

Related

electronic components news Intel Intel sign supply agreement with Micron MICRON
ON Semiconductor wins IoT Star Award for the most influential IoT sensor company of 2019
Previous
Electronic component supply affected by city lockdown in Southeast Asia
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
What is the root cause of the decline of the Japanese semiconductor industry?

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Diodes rolls out USB-C PD3.1 dual-role controllers for high-power devices

Diodes rolls out USB-C PD3.1 dual-role controllers for high-power devices

January 19, 2026
0
Samsung to shut 8-inch S7 fab as mature-node wafer capacity tightens

Samsung to shut 8-inch S7 fab as mature-node wafer capacity tightens

January 19, 2026
0
Micron to buy PSMC fab facilities in $1.8 billion DRAM-linked deal

Micron to buy PSMC fab facilities in $1.8 billion DRAM-linked deal

January 19, 2026
0
TDK rolls out ModCap UHP DC link capacitors for SiC-based high-power inverters

TDK rolls out ModCap UHP DC link capacitors for SiC-based high-power inverters

January 16, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator