SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › LG launches the world's first 5G vehicle communication module based on Qualcomm chip
  • 0

LG launches the world's first 5G vehicle communication module based on Qualcomm chip

SemiMediaEdit
October 17, 2019

According to South Korean media reports, LG Innotek, an electronic component manufacturer of LG, announced on Wednesday that it has developed the world's first 5G vehicle communication module based on Qualcomm chips.

The report pointed out that the chipset running on Qualcomm's Snapdragon Automotive 5G platform detected obstacles four times faster than the LTE chipset. At the same time, thanks to the low latency of 5G, this 5G communication module can activate the emergency braking function of the car when the automatic driving speed reaches 100 kilometers per hour.

LG stressed that in order to solve the heating problem of 5G car chip, the company has applied proprietary RF circuit design technology, high-precision high-density modular technology and heat-resistant materials to the manufacture of 5G modules.

An official at LG Innotek said: "The successful development of the 5G communication module will accelerate manufacturers' commercialization of fully automated and connected cars."

Related

electronic components news LAM-E800 LG Innotek
Infineon announces new microcontroller optimized for automotive 77 GHz radar applications
Previous
Samsung orders 15 EUV machines from ASML to strengthen its foundry business
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

TDK-Lambda releases 60V ORing FET modules with low Rds(on) for redundant power

TDK-Lambda releases 60V ORing FET modules with low Rds(on) for redundant power

March 19, 2026
0
Micron plans new Taiwan fab to boost DRAM and HBM supply

Micron plans new Taiwan fab to boost DRAM and HBM supply

March 19, 2026
0
STMicroelectronics expands robotics, retrains staff to sustain legacy fabs

STMicroelectronics expands robotics, retrains staff to sustain legacy fabs

March 19, 2026
0
Infineon rolls out new VR chips for AI servers to boost power design

Infineon rolls out new VR chips for AI servers to boost power design

March 18, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • Electronic components distributor

SemiMediaEdit

Administrator