SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Infineon adds EasyPACK 2B package to its 1200V Series SiC and IGBT power modules
  • 0

Infineon adds EasyPACK 2B package to its 1200V Series SiC and IGBT power modules

SemiMediaEdit
August 7, 2019

Today, Infineon announced that its 1200 V Series Hybrid Silicon Carbide (SiC) and Insulated Gate Bipolar Transistor (IGBT) power modules are available in the EasyPACK 2B package in ANPC topology and are now available for order.

Infineon said that this module optimizes the loss sweet spots of the CoolSiC MOSFET and TRENCHSTOP IGBT4 chipset, with higher power density and switching frequency up to 48 kHz, especially suitable for the new generation 1500 V solar photovoltaic and energy storage applications.

The new ANPC topology supports more than 99% system efficiency. Compared to devices with lower switching frequencies, the new module can achieve smaller coils in the DC/AC stage of a 1500 V solar in-line converter, so the weight will be much lower than the corresponding inverter with all-silicon components. In addition, the loss of using silicon carbide is less than the loss of silicon, which can reduce the heat of discharge and reduce the size of the heat sink. Overall, it helps to create a more compact inverter and saves system costs.

Related

EasyPACK 2B electronic components news IGBT Infineon SiC
Mouser signs distribution agreement with Superior Sensor
Previous
Cree supplies silicon carbide wafers to ON Semiconductor
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Samsung targets May samples for HBM4E, eyes Nvidia AI demand

Samsung targets May samples for HBM4E, eyes Nvidia AI demand

April 21, 2026
0
Japan quake may disrupt semiconductor supply chain, hit NAND and photoresist output

Japan quake may disrupt semiconductor supply chain, hit NAND and photoresist output

April 21, 2026
0
Shin-Etsu to raise silicone prices as costs pressure semiconductor materials

Shin-Etsu to raise silicone prices as costs pressure semiconductor materials

April 21, 2026
0
UMC plans wafer price hikes in second half as demand stays firm

UMC plans wafer price hikes in second half as demand stays firm

April 20, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator