SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › TI Bluetooth chip was found to have two vulnerabilities
  • 0

TI Bluetooth chip was found to have two vulnerabilities

SemiMediaEdit
November 5, 2018

According to media reports, Israeli company Armis recently revealed that the low-power Bluetooth chip produced by Texas Instruments (TI) contains two major security vulnerabilities. Hackers can use the related vulnerabilities to invade the corporate network, control wireless APs or install malware.

Armis named the vulnerability BLEEDINGBIT. The first BLEEDINGBIT vulnerability affects the TI BLE chip of the CC2640 and CC2650, this vulnerability may cause memory corruption on the stack and further harm the AP's main system.

The second BLEEDINGBIT vulnerability is hidden in the TI BLE chip of CC2540. The chip has Over the Air Download (OAD) function to facilitate firmware update. Although this function is mainly used as a development tool, it is still a back door technically, allow close hackers to access and install malicious firmware. The researchers said that the default configuration of this OAD feature does not contain security mechanisms, can not distinguish between reliable or suspicious firmware updates, hackers can use this feature to invade the corporate network.

Armis CEO Yevgeny Dibrov pointed out that BLEEDINGBIT allows hackers to invade the corporate network silently and disrupt the network segment, which is a big risk to corporate security.

As of now, TI has patched the first vulnerability, and Armis is still evaluating the impact of the BLEEDINGBIT vulnerability.

Related

CC2640 CC2650 Electronic component news TI Bluetooth chip vulnerabilities
u-blox | Internet of Things (IoT) and u-blox
Previous
ADI’s new transceivers bring HD video to all vehicles
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Global chip sales jump over 60% in February on strong demand

Global chip sales jump over 60% in February on strong demand

April 13, 2026
0
Samsung plans $4 billion chip packaging plant in Vietnam

Samsung plans $4 billion chip packaging plant in Vietnam

April 13, 2026
0
Samsung advances 2nm GAA push with Taylor fab targeting 2026 start

Samsung advances 2nm GAA push with Taylor fab targeting 2026 start

April 9, 2026
0
Nexperia China shifts to local wafer supply, targets full localization by 2026

Nexperia China shifts to local wafer supply, targets full localization by 2026

April 8, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Electronic components distributor
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator