SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Rapidus: 2nm chip fab expected to start trial production in April 2025
  • 0

Rapidus: 2nm chip fab expected to start trial production in April 2025

SemiMediaEdit
January 24, 2024

January 24, 2024 /SemiMedia/ -- Rapidus recently stated that the construction of its 2nm chip fab in Chitose City, Hokkaido, Japan is going smoothly and trial production will begin in April 2025 as planned.

Rapidus said that the company has built Japan's first sub-2nm and most advanced logic chip factory, the IIM-1 fab, in Chitose City, Hokkaido in September 2023. In addition, the company has opened a Chitose office in Chitose City on January 22, 2024, to conduct business contacts with local companies and engage in recruitment and other matters.

Regarding the progress of the construction, Rapidus said that there was no delay for a day and the project was progressing according to the schedule.

Rapidus said it has dispatched researchers to the Albany NanoTech Complex, a semiconductor research center in New York, to cooperate with IBM to promote the research and development of 2nm logic chip production technology. In addition, the company also plans to learn from imec the EUV lithography equipment technology required to produce the most advanced chips.

The IIM-1 factory will start trial production in April 2025 and start mass production in 2027. Regarding future plans, Rapidus pointed out that it will also consider building the second and third fabs in the future.

Related

electronic components news Electronic components supplier Electronic parts supplier Rapidus
Vishay upgrades TSOP18xx, TSOP58xx, and TSSP5xx series IR receiver modules with new in-house IC
Previous
Infineon and GlobalFoundries extend long-term supply agreement
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
What is the root cause of the decline of the Japanese semiconductor industry?

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Marvell to buy XConn to expand PCIe and CXL switching for AI data centers

Marvell to buy XConn to expand PCIe and CXL switching for AI data centers

January 20, 2026
0
Vishay adds 550 V and 600 V options to 193 PUR-SI snap-in capacitors

Vishay adds 550 V and 600 V options to 193 PUR-SI snap-in capacitors

January 20, 2026
0
GlobalFoundries to acquire Synopsys ARC processor IP business

GlobalFoundries to acquire Synopsys ARC processor IP business

January 20, 2026
0
Diodes rolls out USB-C PD3.1 dual-role controllers for high-power devices

Diodes rolls out USB-C PD3.1 dual-role controllers for high-power devices

January 19, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator