SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › ADI and Foxconn team up to develop cockpit electronics
  • 0

ADI and Foxconn team up to develop cockpit electronics

SemiMediaEdit
July 25, 2023

July 25, 2023 /SemiMedia/ -- Analog Devices (ADI) and Foxconn jointly announced that they will collaborate to develop digital cockpits and high-performance battery management systems (BMS) for electric vehicles (EVs).

"We are well positioned to blaze a path of change by advancing software-defined, more sustainable, feature-rich vehicles," Foxconn said in a statement.

"The global automotive industry continues to digitize and differentiate at the semiconductor level to deliver a more personalized, immersive and sustainable driving experience," said Vincent Roche, CEO and Chairman of Analog Devices.

"We look forward to working with ADI to leverage its high-performance automotive electronics technology," said Foxconn CEO Young Liu.

Foxconn added: “ADI’s flexible hardware and robust software solutions, combined with Foxconn’s expertise in electronic design, system-level integration and manufacturing prowess have the potential to deliver scalable vehicle platforms to create a more enjoyable and user friendly cockpit experience.”

Related

PSMC plans to build a fab in Japan
Previous
Murata releases new wireless modules delivering enhanced performance for IoT implementations
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Diodes launches programmable buck converter targeting high-density automotive power designs

Diodes launches programmable buck converter targeting high-density automotive power designs

December 5, 2025
0
RS Components sees rising demand for AI-related chips as Indian engineers speed up design cycles

RS Components sees rising demand for AI-related chips as Indian engineers speed up design cycles

December 5, 2025
0
Volkswagen partners with Saxony and TU Dresden to build AI and chip design hub

Volkswagen partners with Saxony and TU Dresden to build AI and chip design hub

December 5, 2025
0
Micron to exit consumer memory chip market

Micron to exit consumer memory chip market

December 4, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator