SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › GlobalFoundries announces acquisition of Renesas' Non-Volatile Resistive RAM technology
  • 0

GlobalFoundries announces acquisition of Renesas' Non-Volatile Resistive RAM technology

SemiMediaEdit
February 14, 2023

Feb. 14, 2023 /SemiMedia/ -- GlobalFoundries recently announced that it has acquired Renesas Electronics Corporation (Renesas)’s proprietary and production proven Conductive Bridging Random Access Memory (CBRAM) technology, a low power memory solution designed to enable a range of applications in home and industrial IoT and smart mobile devices. 

The transaction further strengthens GF’s memory portfolio and extends its roadmap of embedded non-volatile memory (NVM) solutions by adding another reliable, customizable embedded memory solution that is relatively easy to integrate into other technology nodes. Specifically, this technology will enable customers to further differentiate their SoC designs and advance a new generation of secure and intelligent devices. 

“We’re committed to differentiating our technology portfolio to be the foundation of our customers’ energy efficient IoT applications today and for decades to come,” said Mike Hogan, chief business officer of GF. “With the acquisition of this innovative memory technology, GF is now playing an essential role in accelerating development of NVM solutions which will enable our customers to design the next generation of intelligent and connected devices. CBRAM technology unleashes a new paradigm of performance and ultra-low energy use, enabling a wide range of applications, from wearable devices to smartphones, to extend the time between battery charges from hours to weeks to years in specific use cases.” 

In 2020, GF entered into a licensing agreement with Dialog Semiconductor, which was acquired by Renesas in 2021, to offer its CBRAM technology as an embedded, NVM option. Today, CBRAM is being qualified on the company’s 22FDX® platform, with plans to extend it to other platforms. 

Related

Infineon announces registration of its QDPAK and DDPAK packages as JEDEC standard for high power applications
Previous
TDK releases industry's first common mode filter for automotive ethernet 10BASE-T1S
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

VIS says AI demand drives growth as Singapore fab fully booked

VIS says AI demand drives growth as Singapore fab fully booked

May 12, 2026
0
Renesas expands edge AI business with Irida Labs acquisition

Renesas expands edge AI business with Irida Labs acquisition

May 12, 2026
0
NXP to raise semiconductor prices from June amid rising costs

NXP to raise semiconductor prices from June amid rising costs

May 12, 2026
0
AI Demand to Push Global Semiconductor Packaging Market to $618.9 Billion

AI Demand to Push Global Semiconductor Packaging Market to $618.9 Billion

May 11, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator