SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Wolfspeed signs SiC semiconductor supply agreement with Mercedes
  • 0

Wolfspeed signs SiC semiconductor supply agreement with Mercedes

SemiMediaEdit
January 6, 2023

Jan. 6, 2023 /SemiMedia/ -- Wolfspeed announced that it has entered into a strategic partnership with Mercedes-Benz to supply silicon carbide power semiconductors. Wolfspeed's SiC semiconductors will be integrated by Mercedes-Benz into drive systems for future electric vehicle platforms.

Wolfspeed said it will supply Mercedes-Benz from its fabs in Durham, North Carolina, and Massey, New York. The Massey facility is due to open in 2022, where 200mm wafers can be produced. The planned Durham facility is expected to expand the company's SiC production capacity by more than tenfold. Construction of the first phase is expected to be completed in fiscal 2024.

“We are pleased to be supporting Mercedes-Benz, an organization with a long, successful history of providing world-class performance and luxury vehicles, as they introduce next-generation EVs to the market with highly efficient power systems,” says Gregg Lowe, CEO of Wolfspeed. “We are continuing to invest in our manufacturing capacity to support a steepening demand curve for Silicon Carbide devices that will not only improve EV performance and drive greater consumer adoption, but also support the sustainability efforts of global automotive leaders like Mercedes-Benz.”

Wolfspeed did not disclose the agreed supply or financial scope of the strategic agreement in the statement.

Related

electronic components news Electronic components supplier Electronic parts supplier Mercedes Wolfspeed
NXP introduces new i.MX 95 series applications processors, delivering secure, reliable and scalable AI edge platforms
Previous
Car sales plummeted in 2022 due to shortage of auto chips
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

AMD taps GlobalFoundries for MI500 photonics as it advances CPO design

AMD taps GlobalFoundries for MI500 photonics as it advances CPO design

April 22, 2026
0
Microchip launches CLB MCUs to improve timing control and cut system cost

Microchip launches CLB MCUs to improve timing control and cut system cost

April 22, 2026
0
EU to launch Chips Act 2.0 in May to speed funding and boost local ecosystem

EU to launch Chips Act 2.0 in May to speed funding and boost local ecosystem

April 22, 2026
0
Samsung targets May samples for HBM4E, eyes Nvidia AI demand

Samsung targets May samples for HBM4E, eyes Nvidia AI demand

April 21, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator