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electronic components news
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SIA says Q3 global chip sales rose 15.8% as Asia and Americas drive recovery
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Infineon opens dedicated UWB Application Lab in Austria to advance automotive and industrial positioning
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China move to resume Nexperia chip exports signals breakthrough for Europe carmakers
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Micron’s HBM4 delay threatens its position in the next AI memory cycle
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Kaga Electronics expands Thai PCBA capacity to capture China manufacturing shift
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SEMI says AI-driven demand supports 12-inch wafer expansion in Q3
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Infineon TLE994x/TLE995x SoC targets small automotive BLDC and BDC motors
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DDR memory shortages may persist until 2027, Winbond says
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Glass-based MEMS packaging gains momentum as Asia-Pacific maintains lead
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EU and China make progress on Nexperia export talks as auto chip supply remains tight
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