TSMC plans to invest $2.42 billion to build IC packaging and test factory
According to reports, TSMC plans to establish a new high-end IC packaging and test factory in Miaoli County, Taiwan. The north side of the packaging and test factory is scheduled to be completed in May 2021. It is expected that by the middle of 2021, the first phase of the facotry will be operational and will provide about 1,000 jobs.
The report said that the investment of the TSMC IC advanced packaging and test factory will be NT$303.2 billion (approximately US$2.42 billion), which is the highest local investment project in history.
According to public information, TSMC currently has six 300mm fabs, six 200mm fabs and one 150mm fab. Industry insiders said that the advanced IC packaging and test factory will enable TSMC to provide customers with a more complete one-stop service.
The article is originally written by @SemiMediaEdit posted on SemiMedia. All rights reserved.