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Infineon launches CoolGaN™ 600 V GIT HEMT portfolio with superior performance and quality

Infineon launches CoolGaN™ 600 V GIT HEMT portfolio with superior performance and quality

May 8, 2023
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ST introduces flexible isolated buck IC for protected power conversion and gate drive in IGBT, SiC and GaN transistors

ST introduces flexible isolated buck IC for protected power conversion and gate drive in IGBT, SiC and GaN transistors

May 5, 2023
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Infineon enables innovative solution for second life of electric passenger car batteries

Infineon enables innovative solution for second life of electric passenger car batteries

May 2, 2023
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New EiceDRIVER™ 1200 V half-bridge driver IC family with active Miller clamp for optimized ruggedness in high power systems

New EiceDRIVER™ 1200 V half-bridge driver IC family with active Miller clamp for optimized ruggedness in high power systems

April 28, 2023
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Microchip appoints Rich Simoncic as Executive Vice President

Microchip appoints Rich Simoncic as Executive Vice President

April 27, 2023
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AD announces the appointment of Alan Lee as CTO

AD announces the appointment of Alan Lee as CTO

April 26, 2023
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Renesas launches new NB-IoT chipset for India only

Renesas launches new NB-IoT chipset for India only

April 26, 2023
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Nexperia releases 650 V SiC diodes for demanding power conversion applications

Nexperia releases 650 V SiC diodes for demanding power conversion applications

April 25, 2023
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Diodes' high efficiency buck converter offers broad POL design versatility

Diodes' high efficiency buck converter offers broad POL design versatility

April 24, 2023
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Qualcomm introduces advanced IoT solutions to enable new industrial applications

Qualcomm introduces advanced IoT solutions to enable new industrial applications

April 19, 2023
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