According to the latest report from SEMI, from the beginning of 2020 to the end of 2024, the 8-inch wafer production capacity of global semiconductor manufacturers is expected to increase by 1.2 million pieces, an increase of 21%, and will reach a record high of 6.9 million pieces per month.
SEMI pointed out that the proportion of 8-inch production capacity in mainland China will still be the highest this year, at 21%, followed by Japan at 16%.
Last year, 8-inch fab equipment spending climbed to $5.3 billion. As global foundries continue to maintain high capacity utilization to overcome chip shortages, the demand for capacity expansion will push 8-inch fab equipment spending to $4.9 billion this year.
SEMI also pointed out that wafer manufacturers will add 25 new 8-inch production lines in the next five years to meet growing demand, including analog, power management, display driver ICs, MOSFETs, MCUs and sensors, as well as 5G, automotive and IoT and other applications.