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TDK launches new low-resistance soft-terminated MLCC
Vishay launches automotive-grade inductors, offering high temperature operation up to +155°C in 7575 case size
ST and Blues Wireless cooperate to accelerate adoption of cellular technology in embedded applications
Renesas and OmniVision provide integrated reference design for automotive camera systems
Nexperia announces CFP15B package passed the board-level reliability requirements for automotive applications
TDK releases new stray-field compensated 3D HAL® sensors with redundancy function and digital output interfaces
Renesas release 32-bit RX671 MCUs realizing high performance and power efficiency with HMI functions for contactless operation
Vishay introduces high-voltage thick film chip resistors to save board space while reducing component counts and placement costs
TDK releases new miniaturized, common-mode filters for high-temperature automotive applications
Infineon releases IGBT7 with new current ratings to meet higher power density and performance
ST announces mass-market availability of GSMA-compliant eSIM for M2M applications
Renesas introduces new ProXO oscillators for high-performance communications and data center applications
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