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Renesas and OmniVision provide integrated reference design for automotive camera systems
Nexperia announces CFP15B package passed the board-level reliability requirements for automotive applications
TDK releases new stray-field compensated 3D HAL® sensors with redundancy function and digital output interfaces
Renesas release 32-bit RX671 MCUs realizing high performance and power efficiency with HMI functions for contactless operation
Vishay introduces high-voltage thick film chip resistors to save board space while reducing component counts and placement costs
TDK releases new miniaturized, common-mode filters for high-temperature automotive applications
Infineon releases IGBT7 with new current ratings to meet higher power density and performance
ST announces mass-market availability of GSMA-compliant eSIM for M2M applications
Renesas introduces new ProXO oscillators for high-performance communications and data center applications
Diodes Inc. releases precision adjustable current-limit power switch, bringing high-levels protection to automotive subsystems
TDK releases miniaturized, high performance thin-film common-mode filters for mobile devices
ST collaborates with Xilinx to power radiation-hardened FPGAs
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